综合介绍或申报理由：
键合金丝产品一直是半导体封装产业有史以来的首选材料，因其独特的金属化学稳定性和极具作业效率的工艺应用优势，在高端封装领域的焊线中一直占据主导， 如存储器、高端射频、LED 大功率照明产品、光通讯模块、摄像头模组封装、军工领域等。本产品适用于市场上常见的所有的半自动键合设备，拥有良好的机械性能、良好的弧形、良好的热稳定性。 Gold bonding wires have always been the first choice material in the semiconductor packaging industry. Because of its unique metal chemical stability and highly efficient process application advantages, it has always dominated the bonding wire in the field of high-end packaging, such as memory, high-end RF , LED high-power lighting products, optical communication modules, camera module packaging, military fields, etc. This product is suitable for all semi-automatic bonding equipment common in the market, and has good mechanical properties, good arc shape and good thermal stability.

项目缩略图：

相关项目图片：

主要技术参数：
10-50um线径，可按照客户要求提供。DIP/PLCC/SOJ均可使用。 10-50um wire diameter, which can be provided according to customer requirements. DIP/PLCC/SOJ can be used.

技术及工艺创新要点：
高可靠性和高品质取决于严格的成分控制、稳定的产品特性和严格的加工过程的控制。在本产品中我们通过开发高纯金制备技术，将金原材料纯度稳定在4N及以上级别，有效降低丝材的电阻率，导电性能良好。同时通过中间合金均匀化制备技术，避免了偏析现象，使中间合金颗粒成分均一性提高，从而保证了键合金丝产品的一致性。 High reliability and high quality depend on strict composition control, stable product characteristics and strict control of processing process. In this product, by developing high-purity gold preparation technology, we stabilize the purity of gold raw materials at 4N and above, effectively reduce the resistivity of the wire, and have good electrical conductivity. At the same time, the segregation phenomenon is avoided by the homogenization preparation technology of the master alloy, and the uniformity of the composition of the master alloy particles is improved, thereby ensuring the consistency of the bonding wire products.

与国内外同类产品或同类技术的比较情况：
本产品以金作为基体，纯度可达4N及以上级别，通过材料配方设计、微合金化、坯料制备、微细丝拉伸加工、在线退火、定尺绕线、性能检测等关键技术开发，最终获得可靠性更高的高性能键合金丝，满足部分高端封装的需求，打破了键合金丝产品受制于人，被国外市场垄断的现象，达到了国际同类产品技术水平。 This product uses gold as the matrix, and the purity can reach 4N and above. Through the development of key technologies such as material formula design, micro-alloying, billet preparation, micro-filament drawing processing, online annealing, fixed-length winding, and performance testing, the final product is obtained. High-performance bonding wires with higher reliability meet the needs of some high-end packaging, break the phenomenon that bonding wire products are controlled by others and monopolized by foreign markets, and have reached the international technical level of similar products.

实际运用案例和用户评价意见：
作为内引线，可用于中高端LED，COB模组封装和高端IC的封装。并获得客户一致好评。 As an inner lead, it can be used for mid-to-high-end LED, COB module package and high-end IC package. This product has been highly praised by customers.

获奖、专利情况：
依据本产品的开发，获得发明专利一项《一种封装用高性能键合金丝的制备方法》； 专利号：2011103697061 According to the development of the product, an invention patent " A kind of preparation method of high-performance gold bonding wire for encapsulation " is obtained;

专利分类：发明专利

申报单位介绍：
北京达博有色金属焊料有限责任公司是中关村科技园区的国家高新技术企业，成立于1999年12月，注册资金5800万元，现有员工137人，2021年公司销售收入10.9亿元，近几年产销量一直居于内资企业第一。 公司的主要产品为集成电路(IC、LSI、ULSI)、半导体分立器件（TR）和半导体照明（LED）封装和摄像头模组封装用键合金丝、键合铜丝、钯铜丝、键合银丝、金银丝及各种合金丝系列产品，同时还生产芯片背金蒸镀用蒸发金、蒸发金砷、蒸发银的丝材和段材。 达博公司专注于电子封装用键合丝的研发与生产，具有雄厚的研发实力，承担了多项国家级、市级课题，通过课题的实施，达博公司完成了先进封装用键合丝所需的工艺升级和关键设备换代，目前拥有完整的键合金丝、铜丝、银丝生产线，生产设备及检测仪器达到国际先进水平，每年可提供10亿米键合丝。 达博公司每年均有成果转化为专利进行保护，自有知识产权的积累在公司的发展中形成了良性循环，截止到目前，公司共计申请专利59件，其中发明专利18件，实用新型专利41件；累计获得证书专利44件，其中发明专利6件，实用新型专利38件。主起草国家标准4件，主起草行业标准1件，参与起草国家标准4件，参与行业标准1件。 达博公司已通过IATF16949、ISO9001质量保证体系、ISO14001环境管理体系认证和QC080000有害物质过程控制管理体系的认证。公司将不断严格管理，持续改进，为广大顾客提供高质量的产品和优质的服务，积极推动电子封装业的发展。 Beijing Doublink Solders Co., Ltd. is a National High-tech Enterprise located in Zhongguancun Technology Park, established in December,1999, with 58 million CNY registered capital. For now, the company has 137 employees, boast an annual sales revenue that exceed 1.09 billion CNY. Also, our annual production and sales revenue have been ranking first in domestic enterprises for several years. Doublink is a professional manufacturer and exporter that is concerned with quality of our products. Its products include gold bonding wire, silver bonding wire, Pd-coated copper bonding wire, Au-coated silver bonding wire, and a series of alloy bonding wire, all used for the packaging technology of IC, LSI, ULSI, TR, LED, and camera module. Also, its product includes evaporated gold, evaporated arsenic gold, evaporated silver wire and section for the evaporation of chip back. Doublink is a company with strong R&D strength focusing on bonding wire for electronic packaging, undertaking many national and municipal projects. With the proceeding of the projects, the company achieves the upgrade of key equipment and process for advanced electronic packaging bonding wire. For now, the company has the complete production lines of gold, silver, copper and alloy bonding wire. Doublink has the international advanced production equipment and detecting instruments, which ensure the production capacity of over 1 billion meter bonding wire per year. Doublink is also a company with good intellectual property protection, it has a virtuous cycle of the accumulation of free intellectual property protection during the developing of company because of the transformation of experimental results and patents. For now, the company applied for 59 patents, including 18 invention patents and 41 utility model patents, obtained 44 certificate patents, including 6 invention patents and 38 utility model patents. Doublink also formulate over 10 national and industrial Standards. Beijing Doublink Solders Co., Ltd. has passed IATF16949, ISO 9001 quality assurance system, ISO 14001 environmental management system certification and QC080000 hazardous substance process control management system certification. The company will continue to strictly manage and continuously improve, provide customers with high-quality products and services, actively promote the development of the electronic packaging industry.