■ 产品特性Features l 8.0 瓦导热系数 Thermal Conductivity 8.0 W/m.kl 优良的散热性 Superior Heat Dissipationl 高耐电压 High Dielectric Strengthl 无卤无铅 Halogen-Free Lead-freel 优秀的耐热性和绝缘可靠性 Excellent Thermal Reliability Insulation Reliability ■ 应用领域Applications 1.高光灯 High Bay; 2.控制器 Controllers; 3.电源模块 Power Modules; 4.电机驱动与整流器 Motor Drives Rectifier; 5.汽车散热模组 Auto Heat Sink Modules. ■ 典型特性Typical Properties Test ItemsTest MethodUnitJHS-T80Thermal Conductivity(100um)ASTM D5470W/m.k7.5Thermal Resistance(100um)ASTM D5470℃*in2/W<0.05Thermal Stress288℃,floatMin10Peel Strength (1oz Cu)288℃/10 secN/mm1.2Hi-pot Voltage(100um)IPC-TM-650 2.5.7AC V3000IPC-TM-650 2.5.7DC V4000Surface ResistivityIPC-TM-650-2.5.17.1MΩ1011Volume ResistivityIPC-TM-650-2.5.17.1MΩ-cm1012Dielectric ConstantC-24/23/50 1MHz-5.3FlammabilityUL-94-V-0Glass Transition Temp. (Tg )DSC℃110Comparative Tracking Index (CTI)UL 746E C-40/25/50V600 All test data provided are typical values and not intended to be specification values,All typical values are based on 1.6mm samples, with aluminum plate thickness of 1.5mm, copper foil thickness of 35μm, and dielectric layer thickness of 100μm.■ 材料信息 SpecificationsItemSpecification尺寸Size(mm)500 x 600, 1000x1200, or etc.总厚度Thickness(mm)1.0, 1.5, 2.0, or etc.介质厚度 Dielectric Thickness (um)50, 75, 100, 125, 150, or etc.铜箔厚度 Copper ThicknessHoz, 1oz, 2oz, 3oz, or etc.金属基材类型 Metal Substrate铝 Al : 1060, 3003, 5052, 6061 铜 Cu : C1100 or etc.如有其他特殊需求,请与我们联系。If you have any special needs, please contact us.