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■ 产品特性Features
l 2.0 瓦导热系数 Thermal Conductivity 2.0 W/m.k
l 优良的散热性 Superior Heat Dissipation
l 高耐电压 High Dielectric Strength
l 无卤无铅 Halogen-Free & Lead-free
l 优秀的耐热性和绝缘可靠性 Excellent Thermal Reliability & Insulation Reliability
■ 应用领域Applications
1. LED 照明 LED Lighting; 2.控制器 Controllers; 3.电源模块 Power Modules;
4.电机驱动与整流器 Motor Drives & Rectifier; 5.汽车散热模组 Auto Heat Sink Modules.
■ 典型特性Typical Properties
Test Items | Test Method | Unit | JHS-T20 |
Thermal Conductivity（100um） | ASTM D5470 | W/m.k | 2.2 |
ASTM D5470 | ℃*in2/W | ＜0.11 | |
Thermal Stress | 288℃，float | Min | >10 |
Peel Strength (1oz Cu） | 288℃/10 sec | N/mm | >1.2 |
Hi-pot Voltage（100um） | IPC-TM-650 2.5.7 | AC V | >3000 |
IPC-TM-650 2.5.7 | DC V | >4000 | |
Surface Resistivity | IPC-TM-650-2.5.17.1 | MΩ | 1011 |
Volume Resistivity | IPC-TM-650-2.5.17.1 | MΩ-cm | 1012 |
Dielectric Constant | C-24/23/50 1MHz | - | 4.6 |
Flammability | UL-94 | - | V-0 |
Glass Transition Temp. （Tg ) | DSC | ℃ | 110 |
Comparative Tracking Index （CTI） | UL 746E C-40/25/50 | V | >600 |
All test data provided are typical values and not intended to be specification values,All typical values are based on 1.6mm samples, with aluminum plate thickness of 1.5mm, copper foil thickness of 35μm, and dielectric layer thickness of 100μm.
■ 材料信息 Specifications
Item | Specification |
500 x 600, 1000x1200, or etc. | |
总厚度Thickness（mm） | 1.0, 1.5, 2.0, or etc. |
介质厚度 Dielectric Thickness （um） | 50, 75, 100, 125, 150, or etc. |
铜箔厚度 Copper Thickness | Hoz, 1oz, 2oz, 3oz, or etc. |
金属基材类型 Metal Substrate | 铝 Al : 1060, 3003, 5052, 6061 铜 Cu : C1100 or etc. |
如有其他特殊需求，请与我们联系。If you have any special needs, please contact us.
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